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M. Volpertl
M. Volpertl
Composite material
Materials science
Electronic engineering
Intermetallic
Soldering
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Towards Reliable 10 mu m Pitch Assembly Using Cu/Ni/SnAg based Interconnects
2017
EPTC | Electronics Packaging Technology Conference
D. Taneja
M. Volpertl
L. Mendizabal
T. Chaira
David H. Henry
F. Hodaj
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