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Anke Hanisch
Anke Hanisch
Fraunhofer Society
Materials science
Wafer
Optoelectronics
Composite material
Flip chip
4
Papers
9
Citations
0
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Investigation of Wafer Dicing and Cleaning Processes for Die-to-die Oxide direct Bonding Technology
2021
ISSE | International Spring Seminar on Electronics Technology
Gaurav Khurana
Anke Hanisch
Catharina Rudolph
Jorg Meyer
Marcel Wieland
Iuliana Panchenko
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Enabling D2W / D2D Hybrid Bonding on manufacturing equipment based on simulated process parameters
2021
ECTC | Electronic Components and Technology Conference
Catharina Rudolph
Anke Hanisch
M. Voigtländer
P. Gansauer
H. Wachsmuth
S. Kuttler
Olaf Wittler
Thomas Werner
Iuliana Panchenko
M.-J. Wolf
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Grain Structure Analysis of Cu/SiO2 Hybrid Bond Interconnects after Reliability Testing
2020
ESTC | Electronics System-integration Technology Conference
Iuliana Panchenko
Laura Wambera
Maik Mueller
Catharina Rudolph
Anke Hanisch
Irene Bartusseck
M. J. Wolf
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Low Temperature Cu Interconnect with Chip to Wafer Hybrid Bonding
2019
ECTC | Electronic Components and Technology Conference
Guilian Gao
Laura Mirkarimi
Thomas Workman
Gill Fountain
Jeremy Theil
Gabe Guevara
Ping Liu
Bongsub Lee
Paweł. Mrozek
Michael Huynh
Catharina Rudolph
Thomas Werner
Anke Hanisch
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Citations (8)
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