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Boris Bouillard
Boris Bouillard
Materials science
Electronic engineering
Light-emitting diode
High voltage
Flip chip
5
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3
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0
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LowK wafer dicing robustness considerations and laser grooving process selection
2020
ESTC | Electronics System-integration Technology Conference
Patrick Laurent
Olivier Robin
Boris Bouillard
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Cu-SnAg Interconnects Evaluation for the Assembly at 10µm and 5µm Pitch
2017
ECTC | Electronic Components and Technology Conference
D. Taneja
Marion Volpert
Gilles Lasfargues
Bertrand Chambion
Boris Bouillard
Sylvie Jarjayes
Tarik Chaira
Aureili Vandeneynde
Yannick Goiran
David H. Henry
F. Hodaj
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High voltage WireLED powered directly by mains 230 Volts
2017
EMPC | European Microelectronics and Packaging Conference
Abdenacer Ait Mani
Boris Bouillard
A. Gasse
Marion Volpert
Brigitte Soulier
D. Henry
A. Vandeneynde
Bertrand Chambion
Frédéric Mercier
Pamela Rueda
Vincent Beix
Thomas Lacave
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Experimental and modelling thermal study of a 3D-stacked silicon based LEDs array concept
2017
THERMINIC | International Workshop on Thermal Investigations of ICs and Systems
Bertrand Chambion
Boris Bouillard
A. Gasse
A. Vandeneynde
N. Ait-Mani
A. Gueugnot
D. Henry
Frédéric Mercier
Pamela Rueda
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Method for covering a transparent conductive oxide layer of a continuous layer of conductive material
2014
Boris Bouillard
Matthieu Manceau
Clément Soumaire
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