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Michael Joo Zhong Lim
Michael Joo Zhong Lim
Nanyang Technological University
Materials science
Copper
Direct bonding
Integrated circuit
Ceramic
3
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0
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2024
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Time-Dependent Evolution Study of Ar/N2 Plasma-Activated Cu Surface for Enabling Two-Step Cu-Cu Direct Bonding in a Non-Vacuum Environment
2021
ECS Journal of Solid State Science and Technology
Liangxing Hu
Simon Chun Kiat Goh
Jing Tao
Yu Dian Lim
Peng Zhao
Michael Joo Zhong Lim
Teddy Salim
Uvarajan M Velayutham
Chuan Seng Tan
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In-Depth Parametric Study of Ar or N2 Plasma Activated Cu Surfaces for Cu-Cu Direct Bonding
2021
ECTC | Electronic Components and Technology Conference
Liangxing Hu
Simon Chun Kiat Goh
Jing Tao
Yu Dian Lim
Peng Zhao
Michael Joo Zhong Lim
Chuan Seng Tan
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Methodology to determine high precision variation in the electrical resistance of copper wires due to corrosion
2020
EPTC | Electronics Packaging Technology Conference
Michael Joo Zhong Lim
Michael Goroll
Hai Guan Loh
Zhong Chen
Chuan Seng Tan
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