How to rework underfilled BGA
2016
A Bal
l Grid Array (BGA) component
has become one of the most popular packaging alternatives for high
density integrated electronics devices. BGA packages become smaller and electrical equipment has become
lighter, therefore such equipment is more sensitive to m
echanical stress. Therefore the underfill of the chips is
used to improve the lifetime and reliability of electronic equipment. On the other hand there are issues with
removing of the underfilled
component
from the printed circuit board (PCB) without damag
ing the PCB together
with soldering pads. The goal of this article is to present the rework possibility of underfilled c
omponents
, when
a very fine milling machine was develop
ed for the components
rework purposes in LVR at CTU in Prague.
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