Finite Element Analysis of Gold Bonding under Different Loading Conditions
2014
In this paper, ANSYS-LSDYNA simulation software is used to build the three-dimensional finite element model of the
ball bondand to get the Von Mises stress. The change of stress about the bump is researched which base on the model in different
bondingpressure,
bondingpower and
bondingtime. The result show that: The stress increase with
bondingpressure increase within a certain
bondingpressure range, and then the stress will maintain a table number, however, the stress will continue to increase when the
bondingpressure reach a certain value; increasing the
bondingpower, the area of lager stress will grow; prolonging the
bondingtime, the stress of the pad will increase with time, but when time increase to a certain value, the stress of the pad will not increase over time.
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