Finite Element Analysis of Gold Bonding under Different Loading Conditions

2014
In this paper, ANSYS-LSDYNA simulation software is used to build the three-dimensional finite element model of the ball bondand to get the Von Mises stress. The change of stress about the bump is researched which base on the model in different bondingpressure, bondingpower and bondingtime. The result show that: The stress increase with bondingpressure increase within a certain bondingpressure range, and then the stress will maintain a table number, however, the stress will continue to increase when the bondingpressure reach a certain value; increasing the bondingpower, the area of lager stress will grow; prolonging the bondingtime, the stress of the pad will increase with time, but when time increase to a certain value, the stress of the pad will not increase over time.
    • Correction
    • Source
    • Cite
    • Save
    5
    References
    0
    Citations
    NaN
    KQI
    []
    Baidu
    map