A method of producing wafers, in particular of wafers for solar cells, and apparatus for producing wafers

The invention relates to a method of manufacturing wafers (100), in particular of wafers (100) for solar cells, in which a block-shaped wafer body (10) to a support member (20) is fixed and the wafer base (10) of the (carrier member 20 ) remote side is divided by a separating means (25), in particular by means of a wire saw, in the disk-shaped wafer (100). According to the invention, it is provided that the wafer base body (10) non-positively by means of an adhesive-free connection technique and / or positively to the support member (20) is attached.