Study on thermal resistance of brass with and without coating of metallic surface

Abstract The thermal interface material (TIM) is basically one of the best selections to solve the thermal issues in electronic packaging applications. The basic functions of TIM are to fill micro or nano sized rough surfaces (viz., valleys, gaps etc) between two conducting materials and to improve the thermal conduction and reducing the thermal contact resistance between them. In the present study, brass substrate with and without coating of metallic substrate is considered as TIM material and thermal contact resistance of the same is assessed. Tin (Sn) is considered as a metallic coat on brass substrate. The contact pressure at the interface was varied with and without application of load (kg) to investigate the thermal contact resistance. Results indicated that Sn coated brass interface material exhibited better thermal performance than bare brass substrate.