Method and apparatus for detection of defects

A method of detecting defects, especially of micro-cracks, with thin wafer plates, in particular in semiconductor or silicon wafers, or in coated silicon glass carriers, is illuminated by means of light, the wafer or the coated Silizum glass substrate and the transmitted light at least one camera is received, generates at least a first image of at least a portion of which is evaluated in an image processing, characterized in that the wafer (11, 41, 111) or the coated glass substrate from at least two spatially different directions through lights and transmitted light of each light source (24, 25, 44, 45, 124, 125, 126) by means of at least one camera (22, 23, 48, 49, 122) is received and that are thus generated at least two images analyzed in the image processing ,