Fabrication of Tactile Display Using Arrayed SMA Film Actuator on Silicon TSV Substrate with Individually Conducting Diode

This paper describes the fabrication of novel MEMS-structured tactile display device with SMA thick film actuator array (5×5) bonded to an Si substrate with through-substrate via (TSV) structure with bottom-side-electrodes. The SMA and TSV substrates were successfully bonded with a patterned negative resist SU-8 as an adhesion layer. Arrayed diode elements were also formed in the Si TSV substrate to connect to the SMA actuators for individual driving without backflow current from external print-circuit with simple matrix-like wiring.