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VLSI ultrasonic bonding nondestructive quality control with thermal waves
VLSI ultrasonic bonding nondestructive quality control with thermal waves
1994
R. Ryłko
Z. Suszyński
Keywords:
Mathematics
Control engineering
Ultrasonic welding
Ultrasonic sensor
Very-large-scale integration
Nondestructive testing
Electronic engineering
ultrasonic bonding
Mechanical engineering
thermal methods
Thermal
thermal wave
Correction
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