The stress strain analysis under the reverse load of the embedded baseplate micro-scale grid array welder

Established embedded substrate microscale ball grid array solderthree point bending stress and strain finite element analysis model, analyzed the solderjoint materials, spot diameter and the influence of the bending stress and strain of solderpad diameter, the results show that the torque load, the embedded type substrate microscale BGA solderjoint array of maximum stress and strain are occurred to the periphery on the solderjoint around the corner, and the maximum stress and strain in contact with the PCB side of the edge. When applying the same under torsion load: in SAC305, SAC387, 63 sn37pb, 62 sn36pb2ag four soldermaterials, adopting SAC387 solderjoint maximum equivalent stress is the largest, 62 minimum bending stress sn36pb2ag material welds; When the diameter of the solderwas reduced from 105 mu m to 80 mu m, the internal stress strain of the microscale CSP solderwas decreased. When the diameter of the disc was reduced from 80 mu m to 60 mu m, the internal stress strain of the micro-scale welder was increased.