Open Defect Detection in Assembled Circuit Boards with Built-In Relaxation Oscillators

In this article, we propose two kinds of electrical interconnect test methods for production tests and field ones of assembled circuit boards, which are performed prior to and after shipping to market, respectively. For these tests, we also propose a built-in test circuit. The methods we followed are based on the oscillation frequency of a relaxation oscillator (ROsc) embedded in integrated circuits (ICs). The frequency is measured as the number of pulse signals within a specified test time. Using the test methods, open defects at the interconnects between IC pins and a printed circuit board (PCB) are detected that are modeled as a resistor, a capacitor, and an open-circuit fault. We examined the detectability of open defects using the process variations afforded by SPICE simulation. The simulation results show that open defects were detected, modeled as a resistor of 45.8 $\Omega $ or above, along with open defects modeled as a capacitor and an open-circuit fault using the production test method. In addition, a resistance increase of 1.2 $\Omega $ at defect-free interconnects occurred after shipping to market was detected using the field test method. We also prototyped ICs with embedded ROscs and built an experimental circuit made of the ICs on PCBs. Moreover, we experimentally examined whether open defects could be detected. The results show that with the production test method, open defects modeled as a resistor of 10 $\Omega $ or above and modeled as a capacitor and an open-circuit fault can be detected.