One-Step Multicomponent Encapsulation by Compound-Fluidic Electrospray
2008
Fabrication of sophisticated or
smart materialsoften needs controlled integrating multiple components into a single capsule. Most of conventional microencapsulation strategies merely envelop one content into a shell every time. We report a compound-
fluidic
electrospraymethod could one-step enclose multiple components into a single microcapsule without contact. The as-prepared microcapsules have multiple compartments inside, in each of which different content can be addressably loaded. This approach gives flexibility for generating diverse microcapsules that could one-step integrate different active components in microscopic domain free of contact, which may find potential applications in multicomponent drug delivery,
microreactorsand others.
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