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Evaluation of bending stress in Au-wiring formed over chip-embedded flexible-hybrid-electronics by micro-Laue diffraction
Evaluation of bending stress in Au-wiring formed over chip-embedded flexible-hybrid-electronics by micro-Laue diffraction
2021
Murugesan Mariappan
Yuki Susumago
Kazushi Sumitani
Yasuhiko Imai
Shigeru Kimura
Takafumi Fukushima
Keywords:
Materials science
Optoelectronics
Chip
Electronics
X-ray crystallography
Bending
Correction
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