Effect of Temperature on the Mechanical Property of the Film-Substrate Interface of Diamond Coatings

Model of the film-substrate interface of diamond coatings is built with the method of molecular dynamic, and the molecular dynamic simulation is applied to study the mechanical property of the model based on the Morse potential function and Tersoff potential function with temperature ranging from 0K to 800K. The results show that the adhesive strength of the interface between the diamond coatings and the cemented carbide substrate behaves a downward trend when the temperature rises from 0K to 800K and the downward trend is sharp when the temperature increases from 0K to 300K and the downward trend is smooth when the temperature rises from 300K to 800K. Meanwhile, the varying trend of the energy with the temperature is similar to the adhesive strength.