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Invited) Processing and Integration Considerations for Successful Copper Electrodeposition in 3D IC Applications
Invited) Processing and Integration Considerations for Successful Copper Electrodeposition in 3D IC Applications
2012
J. S. Papanu
M. Cogorno
D Erickson
Keywords:
Manufacturing engineering
Copper
Three-dimensional integrated circuit
Materials science
Metallurgy
Nanotechnology
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