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Quality Improvement by Preliminary Action through the Semiconductor Wire Bonding Process TRIZ
Quality Improvement by Preliminary Action through the Semiconductor Wire Bonding Process TRIZ
2021
Kwang Jun Lee
Yong-Won Song
Hong Kyun Shim
Sang Ook Jun
Chan-Ho Park
Keywords:
TRIZ
Process (computing)
Mechanical engineering
Materials science
action
Quality management
Semiconductor
Wire bonding
Correction
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