Reliability analysis of bonding wire based on stacked substrate packaging structure

Chi Zhang,Yifan Tan,Zhizhao Huang,Cai Chen,Yong Kang

Reliability analysis of bonding wire based on stacked substrate packaging structure

2019

Chi Zhang
Yifan Tan
Zhizhao Huang
Cai Chen
Yong Kang

Abstract The stacked substrate packaging technology is a new 3D power loop structure utilizing multiple layer DBC to achieve ultra-low parasitic for the fast switching SiC device. This structure ha...

Keywords:

Substrate (chemistry)
Packaging engineering
Optoelectronics
dBc
Materials science
Wire bonding
multiple layer
fast switching

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